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DiTEC Polishing Compound - Fine Cut - 32oz (PC-CMPD-FCO2)

DiTEC Polishing Compound - Fine Cut - 32oz (PC-CMPD-FCO2)

$84.00
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Product Description

Polishing Compound - Fine Cut - 32oz

This advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it's safe for all paint types - fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.

Features:

  • Effectively removes holograms
  • Free of solvents and silicone
  • Appearance: Cream/Paste
  • Solubility: N/A
  • pH: 8

Use & Application:

For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.

Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure.

Specifications:

  • Type: Restoration & Compounds
  • Box Dimensions: 3"H x 3"W x 10"L WT: 2.35 lbs
  • UPC: 850019168440

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